Japan Di Cisco borrows superb technology to cross the LED
Japan's DISCO High Tech (DISCO) launched the thinning (DGP8761) and laser technology of the excellent LED sapphire substrate at the SEMICON Taiwan 2010 exhibition held recently.
The thinning of the LED sapphire substrate can shorten the processing steps related to LED manufacturing and reduce the environmental load; and reduce the processing steps, reduce the risk of damage, and reduce the environmental load through full automation. In laser technology, the DFL7340 has invisible cutting, which uses the light collecting inside the workpiece to form a metamorphism, and uses the tape expander to cut the chip, without giving the workpiece a mechanical load or a dry process without using water.
At the same time, the HC System DGP8761HC is introduced for the TSV package, and the high-cleaning power can be realized for the epitaxial wafer after polishing (CMP). For the Haze method, the processing axis for the dedicated Pad can be added, and the transport portion can be added to reduce the polishing load.
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