TSMC: 3nm wafer fab builds in 2020
Taiwan Semiconductor Manufacturing Co., founder and chairman Zhang Zhongmou disclosed in a recent company meeting that TSMC will start construction of a 3nm process fab in 2020, but will not go to the United States to set up a factory, but insists on staying in Taiwan, to be exact. Southern Science Park.
Zhang Zhongmou proposed that TSMC believes that the local government will solve the hydropower land problem required for the construction of the 3nm plant and provide full assistance.
According to Zhang Zhongmou's previous statement, the construction of the 3nm plant is expected to cost more than US$20 billion. At the same time, it is expected that the relevant suppliers will be encouraged to follow up the construction of the plant and to drive the economic development in the Tainan region.
He did not disclose when the 3nm plant was completed or when the new process was in mass production, but even without considering additional difficulties and challenges, the fastest thing would be 2023.
Even so, TSMC will still be far ahead of industry giant Intel, who has not yet entered the 10nm process. According to the steps of using three generations of products in each generation, it is very likely that the realization of 3nm will take ten years.
Zhang Zhongmou also estimates that TSMC’s revenue growth will be 5-10% in the next three years.
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