Now LED COB package , in fact, you can see most of the COB package, including Japan's package COB technology, they are based on the base substrate package, which is to integrate N chips on the inner substrate. For encapsulation, this is the COB technology that everyone says. Everyone knows that the underlying substrate of the substrate is copper foil. The copper foil can only be energized very well, and can't do good optical processing.
MCOB is different from the traditional one. The MCOB technology is that the chip is placed directly in the optical cup. It is made according to optics. It is not only a cup, but also a lot of cups. This is also based on a simple principle. LED chip light is concentrated. Inside the chip, to allow more light to run out, it requires a lot of angles, that is, the more ports that emit light, the better the efficiency, the MCOB low-power package and the high-power package.
In any case, the low-power package efficiency must be greater than 15% of the high-power package, the high-power chip is large, and the light-emitting area is only 4, but the small chip is divided into 16 pieces, and the light-emitting area is 4 times 16 Therefore, the light-emitting area is larger than it, so we increase the light-emitting efficiency by 15% anyway. For this reason, MCOB is not a cup. MCOB is also looking for multiple cups to make it more efficient. It is because of the multi-cup MCOB. The technology, its light output efficiency is more than the current common cob is reflected in the light efficiency.
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